No |
À̸§ |
¿¬±¸ºÐ¾ß |
Àü°ø(Çаú) |
139 |
Shuping Xiong |
Human factors/ergonomics, HMI |
»ê¾÷¹×½Ã½ºÅÛ°øÇаú |
138 |
°±â¹ü |
Semiconductor Materials Growth, 2D Materials/Devices, Atomic-Level Engineering |
½Å¼ÒÀç°øÇаú |
137 |
°¼ºÈÆ |
Bioinspired Materials, Architected Materials, 3D Printing |
½Å¼ÒÀç°øÇаú |
136 |
°ÁØÇõ |
Wireless Communications |
Àü±â¹×ÀüÀÚ°øÇÐ |
135 |
±Ç°æÇÏ |
°í¼ÓÅë½Å, ¹ÙÀÌ¿À ¸ÞµðÄà ½Ã½ºÅÛ, ¹èÅ͸® °ü¸® |
Àü±â¹×ÀüÀÚ°øÇÐ |
134 |
±Ç¿µÁø |
½Ã½ºÅÛ¡¤³×Æ®¿öÅ©, ½ÃÅ¥¾î ÄÄÇ»ÆÃ |
Àü»êÇаú |
133 |
±è°æ¹Î |
Semiconductor process and devices, Oxide thin film, Nanoscience |
½Å¼ÒÀç°øÇаú |
132 |
±è´ë½Ä |
Neuroscience, High-field MRI, Neuro-Engineering, Brain Reverse Engineering |
Àü±â¹×ÀüÀÚ°øÇÐ |
131 |
±è´ë¿µ |
Real-time and Embedded Systems, RFID/Sensor Networks, Robot |
Àü»êÇаú |
130 |
±èµ¿ÁØ |
Computer Architecture, Memory System, Interconnection Networks, Mobile System |
Àü±â¹×ÀüÀÚ°øÇÐ |
129 |
±è¹üÁØ |
¹ÝµµÃ¼ ¼ÒÀÚ (Organic and Polymer Electronics) |
»ý¸íÈÇаøÇаú |
128 |
±èºÀÁø |
VLSI, ȸ·Î ¹× Ĩ ¼³°è, Â÷¼¼´ë ÄÄÇ»ÆÃ, Åë½Åȸ·Î ¹× Çϵå¿þ¾î °¡¼Ó±â ¼³°è |
Àü±â¹×ÀüÀÚ°øÇÐ |
127 |
±è»ó½Ä |
³ª³ë±¤ÇÐ, ±¤ÇÐÁýÀûȸ·Î, ½Ç¸®ÄÜÆ÷Åä´Ð½º |
Àü±â¹×ÀüÀÚ°øÇÐ |
126 |
±è»ó¿í |
Nanopatterning, organic solar cells, carbon nanotubes/graphene nanodevices |
½Å¼ÒÀç°øÇаú |
125 |
±è»óÇö |
Semiconductor devices |
Àü±â¹×ÀüÀÚ°øÇÐ |
|