No À̸§ ¿¬±¸ºÐ¾ß Àü°ø(Çаú)
149 Shuping Xiong Human factors/ergonomics, HMI »ê¾÷¹×½Ã½ºÅÛ°øÇаú
148 °­±â¹ü Semiconductor Materials Growth, 2D Materials/Devices, Atomic-Level Engineering ½Å¼ÒÀç°øÇаú
147 °­¼ºÈÆ Bioinspired Materials, Architected Materials, 3D Printing ½Å¼ÒÀç°øÇаú
146 °­ÁØÇõ Wireless Communications Àü±â¹×ÀüÀÚ°øÇÐ
145 ±Ç°æÇÏ °í¼ÓÅë½Å, ¹ÙÀÌ¿À ¸ÞµðÄà ½Ã½ºÅÛ, ¹èÅ͸® °ü¸® Àü±â¹×ÀüÀÚ°øÇÐ
144 ±Ç¿µÁø ½Ã½ºÅÛ¡¤³×Æ®¿öÅ©, ½ÃÅ¥¾î ÄÄÇ»Æà Àü»êÇаú
143 ±è°æ¹Î Semiconductor process and devices, Oxide thin film, Nanoscience ½Å¼ÒÀç°øÇаú
142 ±è´ë½Ä Neuroscience, High-field MRI, Neuro-Engineering, Brain Reverse Engineering Àü±â¹×ÀüÀÚ°øÇÐ
141 ±è´ë¿µ Real-time and Embedded Systems, RFID/Sensor Networks, Robot Àü»êÇаú
140 ±èµµ°æ Nano Ceramics for Energy and Structural Applications ½Å¼ÒÀç°øÇаú
139 ±èµµÇö ¹Ì¼¼ÀüÀÚ°øÁ¤ (microelectronic processes) »ý¸íÈ­ÇаøÇаú
138 ±èµ¿ÁØ Computer Architecture, Memory System, Interconnection Networks, Mobile System Àü±â¹×ÀüÀÚ°øÇÐ
137 ±è¸íÈ£ ÀΰøÁö´É¡¤Á¤º¸¼­ºñ½º, ¼Ò¼È ÄÄÇ»ÆÃ, ½Ã½ºÅÛ¡¤³×Æ®¿öÅ© Àü»êÇаú
136 ±è¹üÁØ ¹ÝµµÃ¼ ¼ÒÀÚ (Organic and Polymer Electronics) »ý¸íÈ­ÇаøÇаú
135 ±èºÀÁø VLSI, ȸ·Î ¹× Ĩ ¼³°è, Â÷¼¼´ë ÄÄÇ»ÆÃ, Åë½Åȸ·Î ¹× Çϵå¿þ¾î °¡¼Ó±â ¼³°è Àü±â¹×ÀüÀÚ°øÇÐ