No |
À̸§ |
¿¬±¸ºÐ¾ß |
Àü°ø(Çаú) |
149 |
Shuping Xiong |
Human factors/ergonomics, HMI |
»ê¾÷¹×½Ã½ºÅÛ°øÇаú |
148 |
°±â¹ü |
Semiconductor Materials Growth, 2D Materials/Devices, Atomic-Level Engineering |
½Å¼ÒÀç°øÇаú |
147 |
°ÁØÇõ |
Wireless Communications |
Àü±â¹×ÀüÀÚ°øÇÐ |
146 |
°ÁöÇü |
Supramolecular Chemistry, Functional Soft Materials, Soft Electronics |
½Å¼ÒÀç°øÇаú |
145 |
±Ç°æÇÏ |
°í¼ÓÅë½Å, ¹ÙÀÌ¿À ¸ÞµðÄà ½Ã½ºÅÛ, ¹èÅ͸® °ü¸® |
Àü±â¹×ÀüÀÚ°øÇÐ |
144 |
±Ç¿µÁø |
½Ã½ºÅÛ¡¤³×Æ®¿öÅ©, ½ÃÅ¥¾î ÄÄÇ»Æà |
Àü»êÇаú |
143 |
±è°æ¹Î |
Semiconductor process and devices, Oxide thin film, Nanoscience |
½Å¼ÒÀç°øÇаú |
142 |
±è´ë½Ä |
Neuroscience, High-field MRI, Neuro-Engineering, Brain Reverse Engineering |
Àü±â¹×ÀüÀÚ°øÇÐ |
141 |
±è´ë¿µ |
Real-time and Embedded Systems, RFID/Sensor Networks, Robot |
Àü»êÇаú |
140 |
±èµµ°æ |
Nano Ceramics for Energy and Structural Applications |
½Å¼ÒÀç°øÇаú |
139 |
±èµµÇö |
¹Ì¼¼ÀüÀÚ°øÁ¤ (microelectronic processes) |
»ý¸íÈÇаøÇаú |
138 |
±èµ¿ÁØ |
Computer Architecture, Memory System, Interconnection Networks, Mobile System |
Àü±â¹×ÀüÀÚ°øÇÐ |
137 |
±è¸íÈ£ |
ÀΰøÁö´É¡¤Á¤º¸¼ºñ½º, ¼Ò¼È ÄÄÇ»ÆÃ, ½Ã½ºÅÛ¡¤³×Æ®¿öÅ© |
Àü»êÇаú |
136 |
±è¹üÁØ |
¹ÝµµÃ¼ ¼ÒÀÚ (Organic and Polymer Electronics) |
»ý¸íÈÇаøÇаú |
135 |
±è»ó½Ä |
³ª³ë±¤ÇÐ, ±¤ÇÐÁýÀûȸ·Î, ½Ç¸®ÄÜÆ÷Åä´Ð½º |
Àü±â¹×ÀüÀÚ°øÇÐ |
|